Manufacturing Engineer Packaging & OSAT

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration.

This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers.

The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness.

This role isremote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Who You Are

- A manufacturing or process engineer with 5+ years of experience in semiconductor packaging, OSAT manufacturing, assembly engineering, PCBA manufacturing, product engineering, NPI, or a closely related environment.

- Experienced with semiconductor assembly, package manufacturing, package test, board assembly, final product manufacturing, or taking a package, assembly process, or manufacturing line from development through sustaining operations.

- Comfortable working directly with OSATs, substrate and bumping suppliers, test houses, contract manufacturers, and other external manufacturing partners.

- A data-driven problem solver and strong communicator who can interpret package drawings, BGA maps, BOMs, PCB data, process and quality reports, reliability results, and manufacturing documentation while driving decisions across engineering, operations, quality, and suppliers.

What We Need

- Translate package requirements into executable assembly process flows, manufacturing specifications, control plans, inspection requirements, acceptance criteria, supplier deliverables, and complete manufacturing documentation.

- Lead factory commissioning, line bring-up, pilot and engineering builds, qualification lots, first article and reliability activities, mass-production readiness reviews, and partner audits.

- Establish process capability and performance targets—including Cp/Cpk, yield, FPY, defect rates, test escapes, cycle time, OEE, and on-time delivery—and use structured methods such as SPC, DOE, PFMEA, 8D, CAPA, and data-driven problem solving to improve results.

- Own technical issue resolution and controlled change implementation across silicon, package, assembly, test, and factory operations, including nonconforming material, MCOs, ECOs, supplier and material changes, assembly-location changes, package revisions, requalification, and corrective actions.

What Yo