Assembly and Mechanical Lead

About Lyte Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you! About the role - We are seeking an experienced process lead engineer in the field of optical device packaging and assembly with a degree in Mechanical Engineering, Physics or a related field. What you'll do - Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and driveCp,Cpkimprovement. - Support the device packagingRnDand NPI with mechanical design, drawing and thermal modelling. - Support devicetestingautomation and data analysis automation/scripts or software development and implementation. - Work withRnDto understand the device specs, particularly mechanical control outline, and assembly requirements andnegotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs. - Work withOSATs tosupport NPI and volume production contract manufacture with technical SOW drafting. - Act as the technical project manager for owned projects. - Provide DFM, DFR, and DFTinputs for HQRnDteams for device packaging and assembly. - Keep proper documentation, and initiateECN andPCN when needed. - Develop andtrackpackaging andassemblycomponentspecificationsas well as inventory. - Audit/regularly visit our contract Manufacturers and suppliers then provide reports. - Writetechnical reports and present results to internal and external stakeholders. - Build and grow the Operation Process Team worldwide. Required Qualifications - Havea mechanicalengineerdegree with relevant experienceonoptical module and/or Lider assembly. - Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience. - Experience or knowledge of opticalsensors. optical device packaging process, or optical module assembly process. - Experience with assembly process integration for process flow design and continue process improvement. - Expertisemechanical drawingsusingSolidWork, mechanical simulation, and thermal simulation. - Project management capability/experience isa must. - Experience working with foundries, OSATs, assemblyhouses, PCBAfab, and contract manufacturers in process development and yield improvement is important. - The abilityto work independently and take ownership of projects as well as collaboratively in cross-functional teamsis a must. - A fastlearner isa must. - Good workethics isa must - Capableofkeeping company confidential information and IP is a must. Preferred Qualifications - Knowledge or work experience withPCBAis highly desirable. - Former experience of microelectronic and optical devices packaging isdesired. - Understanding Silicon Photonics is a plus. - Experience with FMEA, failure analysis, and 8D report is highly desired. - Supplier quality management experience is a plus. - Knowledge of Lidar and relevant technologies is a plus. - Former experience of writing technical SoW is a plus. - Familiar with ECN,PCN,and documentationishighly desirable. Benefits (subject to location and local regulations) - Competitive salary and equity - Comprehensive medical, dental, and vision coverage - 401(k) retirement plan - Flexible vacation and time-off policy - Collaborative, fast-paced, and inclusive work environment - Opportunity to work on cutting-edge technologies with a highly cross-functional team Originally posted on Himalayas